Topcon offers economical solutions along with highly competitve technology.
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Topcon Vi-4302 Automatic Chip Defect Inspection - Fully automatic wafer / film frame 200-300mm inspection - ReviewLess inspection technology - Multi-area classification, multi-scan recipes - Advanced 2D bump inspection. - High throughput of 150+ WPH (200mm) |
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Topcon Vi-4202 Automatic Chip Defect Inspection - Fully automatic wafer / film frame 100-200mm inspection - ReviewLess inspection technology - Multi-area classification, multi-scan recipes - Advanced 2D bump inspection. - Bump diameter, shape, deviation, bridging, and missing bumps |
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Topcon Vi-1202 Manual Load Chip Defect Inspection - Semi-automatic inspection of wafers 25-200mm - Easy placement of wafers and substrate up to 10mm thick - Configurable to handle film frames, wafers, or Waffle Packs - Multi-Area Classification |
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Topcon Vi-3200 In-Tray Chip Inspection / Sorter - Waffle Pack chip defect inspection - non-contact - Automatic handling, placement and sorting - High throughput of up to 5,000+ chips per hour - Optional backside inspection module |
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Topcon WM-10 Unpatterned Wafer Inspection - Monitor for particles, COPs, Slip, Micro Scratches and Haze - Sensitivity on bare silicon less than 50nm - Throughput (300mm) over 75WPH @ 80nm sensitivity - Dual laser angle with multi-detectors for defect selectivity |
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Topcon WM-7S Unpatterned Wafer Inspection - 50mm - 200mm wafer size capability - Short wavelength Laser Diode provides 90nm sensitivity - Throughput (150mm) over 60WPH - Auto loading and auto sensitivity correction - Masking software, Haze mapping, auto map overlapping - Windows XP, GEM-SECS communication, coordinate mapping |
For more information on Topcon semiconductor products sold in the US, contact DJK Global Group 480-968-3343
